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Bonding capillaries
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Bonding capillaries serve as tools for the connection from the chip to the substrate (pads) in the semiconductor industry. The ceramic bonding capillaries are used for the guidance and ultrasonic-welding of the gold wire. On the basis of a conical raw bore, the roundness and the surface quality of the bore can be highly improved through the application of the Micro Bore Sizing procedures. Besides, the required measurement of the diameter as well as a cylindrical partial bore is achieved.
The length of this cylindrical part can be set exactly, which represents an important quality criterion.
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Front view of processed bonding capillary with a final diameter of 30 µm
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Machined surface of the bore
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ultrasonic-welding
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| Characteristics and tolerances |
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Diameter range 0.030 mm, diameter tolerance 0.0005 mm, surface Ra: < 0.01 µm
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